PCI LIMITED.

	PCB Assembly & Testing


MICRO ASSEMBLY

ADVANCED REWORK
FINEPLACER^® core
FINEPLACER^® core^plus
FINEPLACER^® jumbo rs
FINEPLACER^® pico rs
FINEPLACER^® micro rs
FINEPLACER^® micro hvr
FINEPLACER^® matrix rs
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FINEPLACER^® pico rs
High Density Rework Station

FINEPLACER® pico rs is an enhanced hot air rework station for assembly and rework of all types of SMD components.

The system is a best seller for professional mobile device rework in high density environments. A high level of process modularity allows all rework process steps within one system. The FINEPLACER® pico rs system is at home in R&D, process development, prototyping and production environments.

Application area from 01005 up to large BGA on small to medium sized PCBs, with the goal to have highly reproducible soldering results.

		Highlights*
		Industry-leading thermal management Components from 0.125 mm x 0.125 mm to 90 mm x 70 mm* Board sizes up to 400 mm x 234 mm* High efficiency board heater Closed loop force control* Automated top heater calibration* Placement accuracy better than 5 µm
FINEPLACER^® pico rs

	Features			Benefits
	Automated soldering processes Overlay vision alignment system (VAS) with fixed beam splitter Modular design Integrated Process Management (IPM) Real time process observation camera Adaptive process library Process transfer from system to system			Hands-off component placement, user independent process operation Outstanding placement accuracy and instant operation without adjustments Provides high level of application flexibility Synchronized control of all process related parameters: force, temperature, time, flow, power, process environment and illumination Immediate visual feedback reduces process development time Fast and easy process development Identical results on different machines allow central profile development,administration and distribution

	Processes			Applications
	Component removal Site cleaning Re-balling (array, single) Paste printing (component, PCB) Paste dipping Paste dispensing Fluxing Soldering Desoldering			Soldering of: - `BGA, µBGA, QFN, DFN, PoP, QFP, PGA, SON` - `Small passives down to 01005` - `RF shields, RF frames` - `Connectors, sockets` - `Sub assemblies, daughter boards` - `Flipchip (C4)` Pin in Paste (PiP) Trough Hole Reflow (THR) Reworkable underfill, conformal coating Single ball rework

	Technical SpecificationsApplications
	Placement accuracy:	5 µm
	Field of view (min)¹:	11.5 mm x 8.6 mm
	Field of view (max)¹:	69 mm x 53 mm
	Component size (min)¹:	0.125 mm x 0.125 mm
	Component size (max)¹:	40 mm x 40 mm
	Thermocouples²*:	2-8
	Top Heating²:
	Power:	900 W
	Temperature ramp rate:	1 K/s - 50 K/s
	Flow range:	10 Nl/min - 70 Nl/min
	Board Heating²:
	Power:	1600 W
	Heated area (max):	280 mm x 250 mm
	Flow range:	32 Nl/min - 160 Nl/min

	Modules & Options
	Board Printing Tools Process Start Sensor Direct Component Printing Module (DCP) Flux Transfer Module Process Video Module Solder Removal Module Top Heating Module MiniOven 04	Bottom Heating Modules Component Presentation Dispenser Module Process Gas Switching Reballing Module Split Field Optics HOTBEAM

* depending on configuration/application
1 standard value, other values on request
2 optional module

For more information please contact :-

primegroup@vsnl.com

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