FINEPLACER® femto FINEPLACER® lambda FINEPLACER® pico ama FINEPLACER® matrix ma FINEPLACER® pico ma
MICRO ASSEMBLY
FINEPLACER® femto Automated Sub-micron Die BonderUp to 0.5 micron accuracy Production platform Click for details Product Videos FINEPLACER® lambda Flexible Sub-micron Die BonderUp to 0.5 micron accuracy Application versatility Click for details Product Videos FINEPLACER® pico ama Automated Flip Chip BonderUp to 5 micron accuracy High flexibility Click for details Product Videos FINEPLACER® matrix ma Semi-automatic Die BonderUp to 3 micron accuracy 300 mm wafer bonder Click for details Product Videos FINEPLACER® pico ma Multi-purpose Die BonderUp to 5 micron accuracy Application versatility Click for details Product Videos
MICRO ASSEMBLY
ADVANCED REWORK
