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	PCB Assembly & Testing


MICRO ASSEMBLY
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FINEPLACER^® lambda
Flexible Sub-micron Die Bonder

The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications.

It is the ideal choice for low volume production, prototyping, education and R&D where process flexibility is the key.

This cost- effective die bonder handles a wide range of sophisticated processes, including Indium bonding as well as extremely sensitive materials such as GaAs or GaP.

		Highlights
		Sub-micron placement accuracy Unique optical resolution Handles ultra small components Special tools allow object sizes down to 5 µm* Supported substrate size up to 6" * Closed loop force control* Small footprint and compact design Optics movement with programmable positions
FINEPLACER^® lambda

	Features			Benefits
	Automated processes Overlay vision alignment system (VAS) with fixed beam splitter Robust construction and modular design Integrated Process Management (IPM) Real time process observation camera Adaptive process library Process transfer from system to system Virtually unlimited range of advanced bonding technologies			Hands-off die placement, user independent process operation Outstanding placement accuracy and instant operation without adjustments Provides high level of reproducibility and application flexibility Synchronized control of all process related parameters: force, temperature, time, flow, power, process environment, light and vision Immediate visual feedback reduces process development time Fast and easy process development Process transfer from R&D to production saves time, guarantees reliable results ROI savings - one machine for all applications

	Technologies			Applications
	Thermocompression Thermosonic Ultrasonic Soldering (AuSn, C4, Indium, eutectic) Adhesive technologies Curing (UV, thermal) Mechanical assembly			Laser diode, laser bar bonding VCSEL, photo diode assembly LED bonding Micro optics assembly MEMS packaging Sensor packaging 3D packaging Wafer level packaging (W2W, C2W) Chip on glass, chip on flex Flip chip (face down) Precise die bonding (face up)

	Technical SpecificationsApplications
	Placement accuracy*:	± 0.5 µm
	Field of view (min)1:	0.4 mm x 0.3 mm
	Field of view (max)1:	6 mm x 4.5 mm
	Component size (min):	0.1 mm x 0.1 mm
	Component size (max):	15 mm x 15 mm
	Theta fine travel:	± 5°
	Z-travel	10 mm
	Working area1:	190 mm x 52 mm
	Bonding force range2*:	0.1 N - 400 N
	Heating temperature (max)1,2*:	400 °C

	Modules & Options
	Bonding Force Module (manual) Chip Heating Module Die Pick-up Module Formic Acid Module Process Gas Module Substrate Heating Module UV Curing Module	Bonding Force Module (automatic) Die Flip Module Dispenser Module Optics Shifting Process Video Module Ultrasonic Module

* depending on configuration/application
1 standard value, other values on request
2 optional module

For more information please contact :-

primegroup@vsnl.com

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