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FINEPLACER® femto
Automated Sub-micron Die Bonder
Up to 0.5 micron accuracy Production platform

The FINEPLACER® femto is a fully automated, sub-micron bonding platform for advanced packaging and optoelectronic applications.

This award winning system offers modular application architecture and can be flexibly equipped for a wide range of applications and processes. It is an ideal system for a production environment as well as for product and process development, accommodating the complete production workflow of inspection, characterization, packaging, final test and qualification.

FINEPLACER® femto has the best cost - performance ratio of its class in the market.

     Highlights
 
  • Sub-micron placement accuracy*
  • Handles ultra small to very large components
  • Fully-automated operation and assembly process
  • Supports wafer/substrate sizes up to 12" *
  • Supports bonding forces up to 500 N*
  • Highly flexible platform architecture
  • Small footprint and compact design
  • Long-term stability
    		•

    FINEPLACER® femto

    		    

      Features     Benefits  
     
  • Automated pattern recognition, alignment and bonding
  • Overlay vision alignment system with fixed beam splitter in combination with automatic field extension and zoom
  • Integrated Process Management (IPM)
  • Adaptive process library
  • Live process observation camera
  • Virtually unlimited range of advanced bonding technologies
    		•     
  • Fully automated, user independent process
  • Outstanding placement accuracy and instant operation without adjustments
  • Synchronized control of all process related parameters: force, temperature, time, power,
  • process environment, light and vision
  • Fast and easy process development
  • Immediate visual feedback reduces process development time
  • ROI savings - one machine for all applications

    		•   

      Technologies     Applications  
     
  • Thermocompression
  • Thermosonic
  • Ultrasonic
  • Soldering (AuSn, C4, Indium, eutectic)
  • Adhesive technologies
  • Curing (UV, thermal)
  • Mechanical assembly
    		•     
  • Laser diode, laser bar bonding
  • VCSEL, photo diode assembly
  • LED bonding
  • Micro optics assembly
  • MEMS packaging
  • Sensor packaging
  • 3D packaging
  • Wafer level packaging (W2W, C2W)
  • Chip on glass, chip on flex
  • Flip chip (face down)
  • Precise die bonding (face up)

    		•   

      Technical SpecificationsApplications  
         Placement accuracy*: ± 0.5 µm  
         Field of view (min)1: 0.27 mm x 0.2 mm  
         Field of view (max)1: 3.2 mm x 2.4 mm  
         Component size (min): 0.1 mm x 0.1 mm  
         Component size (max): 100 mm x 100 mm  
         Theta fine travel: ± 9° / 3.5 µrad  
         Z-travel / resolution: 10 mm / 0.2 µm  
         Y-travel / resolution: 150 mm / 0.1 µm  
         X-travel / resolution: 450 mm / 0.1 µm  
         Working area: 450 mm x 150 mm  
         Heating temperature1,2: 400 °C  
         Bonding force range*: 0.1 N - 500 N  
       

      Modules & Options  
     
  • Bonding Force Module
  • Die Flip Module
  • Formic Acid Module
  • Process Video Module
  • Substrate Heating Module
  • UV Curing Module

  • Chip Heating Module
  • Dispenser Module
  • Process Gas Module
  • Substrate Handling Module
  • Ultrasonic Module
    		•   
           

    * depending on configuration/application
    1 standard value, other values on request
    2 optional module


    For more information please contact :- 
    primegroup@vsnl.com


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