PCB Assembly & Testing
         

 
   MICRO ASSEMBLY  
   FINEPLACER® femto  
  FINEPLACER® matrix ma  
   FINEPLACER® lambda  
   FINEPLACER® pico ma  
   FINEPLACER® pico ama  
   Product Videos  
   ADVANCED REWORK  




 
 
 

FINEPLACER® matrix ma
Semi-automatic Die Bonder

The FINEPLACER® matrix ma is a semi-automatic bonder representing the latest development from Finetech. Encompassing the “Built to be Best” philosophy, this system points the way forward for the Finetech product family.

Incorporating a new ergonomic approach to bonder design, this state-of-the-art platform, with large working area and high placement accuracy, combines application modularity within an open hardware and software environment.

Supporting a virtually unlimited field of applications and numerous bonding technologies, the system ensures compatibility with future technologies as users transition from R&D into production.

     Highlights
 
  • Placement accuracy 3 µm*
  • Components from 0.1 mm x 0.1 mm to 150 mm x 150 mm*
  • Substrate sizes up to 350 mm x 350 mm*
  • Supports wafer sizes up to 12" *
  • Closed loop force control
  • Real time contrast optimization with LED lighting
  • Low maintenance, easy service access as a design priority
  • Fast conversion from die bonder to rework station*

    • FINEPLACER® matrix ma

    		    

      Features     Benefits  
     
  • Automated processes
  • Overlay vision alignment system (VAS) with fixed beam splitter
  • Integrated Process Management (IPM)
  • Real time process observation camera
  • Process transfer from system to system
  • Virtually unlimited range of advanced bonding technologies
    		•    
  • Hands-off die placement, user independent process operation
  • Outstanding placement accuracy and instant operation without adjustments
  • Synchronized control of all process related parameters: force, temperature, time, flow, power, process environment and illumination
  • Immediate visual feedback reduces process development time
  • Process transfer from R&D to production saves time, guarantees reliable results
  • ROI savings - one machine for all applications

    		•   

      Technologies     Applications  
     
  • Thermocompression
  • Thermosonic
  • Ultrasonic
  • Soldering (AuSn, C4, Indium, eutectic)
  • Adhesive technologies
  • Curing (UV, thermal)
  • Mechanical assembly
    		•     
  • Laser diode, laser bar bonding
  • VCSEL, photo diode assembly
  • LED bonding
  • Micro optics assembly
  • MEMS packaging
  • Sensor packaging
  • 3D packaging
  • Wafer level packaging (W2W, C2W)
  • Chip on glass, chip on flex
  • Flip chip (face down)
  • Precise die bonding (face up)

    		•   

      Technical SpecificationsApplications  
         Placement accuracy: 3 µm  
         Field of view (min)1: 1.2 mm x 0.9 mm  
         Field of view (max)1: 15.7 mm x 11.9 mm  
         Component size (min)1: 0.1 mm x 0.1 mm  
         Component size (max)1: 100 mm x 100 mm  
         Theta fine travel: ± 2°  
         Z-travel 10 mm  
         Working area: 310 mm x 197 mm  
         Bonding force (max)2*: 500 N  
         Heating temperature (max)1,2*: 400 °C  
       

      Modules & Options  
     
  • Bonding Force Module
  • Die Flip Module
  • Formic Acid Module
  • Process Gas Module
  • Substrate Heating Module
  • UV Curing Module

  • Chip Heating Module
  • Dispenser Module
  • Optics Shifting
  • Process Video Module
  • Ultrasonic Module
    		•   
           


    * depending on configuration/application
    1 standard value, other values on request
    2 optional module

    For more information please contact :- 
    primegroup@vsnl.com


     ‹‹ Back