PCB Assembly & Testing
         

 
   MICRO ASSEMBLY  
   FINEPLACER® femto  
  FINEPLACER® matrix ma  
   FINEPLACER® lambda  
   FINEPLACER® pico ma  
   FINEPLACER® pico ama  
   Product Videos  
   ADVANCED REWORK  




 
 
 

FINEPLACER® pico ma
Multi-purpose Die Bonder

The FINEPLACER® pico ma, a multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm.

This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bonding.

Designed for prototyping or low-volume production, R&D and universities.

     Highlights
 
  • Placement accuracy 5 µm*
  • Components from 0.125 mm x 0.125 mm to 100 mm x 100 mm*
  • Working area up to 450 mm x 234 mm*
  • Supports wafer/substrate sizes* up to 8" *
  • Supports bonding forces up to 400 N*
  • Can be configured as a hot air rework system
  • Manual and semi-automatic configurations

    • FINEPLACER® lambda

    		    

      Features     Benefits  
     
  • Automated processes
  • Overlay vision alignment system (VAS) with fixed beam splitter
  • Integrated Process Management (IPM)
  • Real time process observation camera
  • Advanced system software with adaptive process library
  • Process transfer from system to system
  • Process flexibility due to modular concept
    		•    
  • Hands-off die placement, user independent process operation
  • Outstanding placement accuracy and instant operation without adjustments
  • Synchronized control of all process related parameters: force, temperature, time, power, process environment, light and vision
  • Immediate visual feedback reduces process development time
  • Fast and easy process development, process recording and reporting, photo capture
  • Process transfer from R&D to production saves time, guarantees reliable results
  • One system handles a wide variety of applications

    		•  

      Technologies     Applications  
     
  • Thermocompression
  • Thermosonic
  • Ultrasonic
  • Soldering (AuSn, C4, Indium, eutectic)
  • Adhesive technologies
  • Curing (UV, thermal)
  • Mechanical assembly
    		•    
  • Laser diode, laser bar bonding
  • VCSEL, photo diode assembly
  • LED bonding
  • Micro optics assembly
  • MEMS packaging
  • Sensor packaging
  • 3D packaging
  • Wafer level packaging (W2W, C2W)
  • Chip on glass, chip on flex
  • Flip chip (face down)
  • Precise die bonding (face up)

    		•  

      Technical SpecificationsApplications  
         Placement accuracy*: 5 µm  
         Field of view (min)1: 1.6 mm x 1.2 mm  
         Field of view (max)1: 20 mm x 15 mm  
         Component size (min): 0.125 mm x 0.125 mm  
         Component size (max): 40 mm x 40 mm  
         Theta fine travel: ± 6°  
         Z-travel 10 mm  
         Working area1: 280 mm x 117 mm  
         Heating temperature (max)1,2*: 400 °C  
         Bonding force (max)1,2*: 400 N  
       

      Modules & Options  
     
  • ACF Module
  • Bonding Force Module (manual)
  • Die Flip Module
  • Dispenser Module
  • Optics Shifting
  • Process Video Module
  • Substrate Heating Module
  • UV Curing Module

  • Bonding Force Module (automatic)
  • Chip Heating Module
  • Die Pick-up Module
  • Formic Acid Module
  • Process Gas Module
  • Scrubbing Module
  • Ultrasonic Module
    		•   
           

    * depending on configuration/application
    1 standard value, other values on request
    2 optional module


    For more information please contact :- 
    primegroup@vsnl.com


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