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   FINEPLACER® coreplus  
   FINEPLACER® jumbo rs  
   FINEPLACER® pico rs  
   FINEPLACER® micro rs  
   FINEPLACER® micro hvr  
   FINEPLACER® matrix rs  
   Related Equipment  
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FINEPLACER® core plus
Energy-efficient, Cost-effective Rework

The FINEPLACER® coreplus is a versatile rework system offering energy-efficient hot gas rework technology for a wide spectrum of SMD components from smallest components to large BGA.

The easy-to-handle machine integrates the complete SMD rework cycle into an compact design, without diminishing functionality. Quite on the contrary, professional features such as automatic calibration, Process Start Sensor, Process Gas Switching, 01005 Rework Package, PCB Recognition and a gesture-based operating interface are available, making the system a future-proof investment.

The energy-efficient large area under-board heater for PCBs supports board sizes up to 400 mm x 310 mm.

With enhanced functionalites, the system is the "Swiss Army Knife" of professional SMD rework.

     Highlights*
 
  • Components from 0.125 mm x 0.125 mm up to 90 mm x 90 mm
  • Eco-friendly thermal management solution with high-efficiency hot gas top and bottom heating
  • Automatic top heater calibration
  • Automatic pick-up / touch-down with force measurement
  • Automated processes
  • Gesture-based operating interface
  • Compact, integrated machine design
  • Cost efficient soldering tools, compatible with all FINEPLACER® rework stations

    • FINEPLACER® core plus

    		    

      Features     Benefits  
     
  • Automated soldering processes
  • Compact and robust design
  • Vision alignment system with fixed beam splitter
  • Intelligent thermal management
  • Real time process observation camera
    		•    
  • User independent process operation
  • The whole rework cycle within one cost-effective system solution
  • Reproducible placement accuracy
  • Coordinated control of all process parameters: temperature, flow, time, process environment
  • Immediate visual feedback reduces process development time

    		•  

      Processes     Applications  
     
  • Component removal / De-soldering
  • Site cleaning
  • Re-balling
  • Paste printing (component, PCB)
  • Paste dipping
  • Fluxing
  • Soldering
    		•    
  • Soldering of:
    •    - BGA, µBGA/CSP, QFN, DFN, PoP, QFP, PGA, SON
       - Small passives down to 01005
       - RF shields, RF frames
       - Connectors, sockets
       - Sub assemblies, daughter boards
  • Pin in Paste (PiP)
  • Trough Hole Reflow (THR)
  • Reworkable underfill, conformal coating

    		•  

      Technical SpecificationsApplications  
         Placement accuracy: 25 µm  
         Field of view (min)1: 12.1 mm x 7.6 mm  
         Field of view (max)1: 65 mm x 45 mm  
         Component size (min)1: 0.25 mm x 0.25 mm  
         Component size (max)1: 60 mm x 60 mm  
         Board size (max)2: 400 mm x 310 mm  
         Board thickness (max): 6 mm  
         Thermocouples: 4  
         Top Heating:  
         Power: 900 W  
         Temperature ramp rate: 1 K/s - 50 K/s  
         Flow range: 10 Nl/min - 70 Nl/min  
         Board Heating:    
         Power: 1600 W  
         Heated area (max): 280 mm x 250 mm  
         Flow range: 32 Nl/min - 160 Nl/min  
           

      Modules & Options  
     
  • 01005 Rework Package (new)
  • PCB Recognition (new)
  • Direct Component Printing Module
  • Solder Removal Module
  • Top Heating Module (new)
  • Process Start Sensor
  • Reballing Module
  • MiniOven 04
    		•
  • 10x Zoom Optics (new)
  • Component Presentation
  • Flux Transfer Module
  • Board Printing Tools
  • Process Gas Switching (new)
  • Process Video Module
  • Split Field Optics
  • HOTBEAM
    		•  
           

    * depending on configuration/application
    1 standard value, other values on request
    2 optional module


    For more information please contact :- 
    primegroup@vsnl.com


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