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Highlights |
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Components from 0.25 mm x 0.25 mm to 90 mm x 80 mm*
Board sizes up to 350 mm x 260 mm*
Closed loop force control
Fully automated operation and soldering process
Precise non-wearing xy planar table
Traceability support with open data interface structure
Flexible, cost effective performance
Placement accuracy 10 µm @ 3 sigma
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FINEPLACER® micro hvr
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Features |
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Benefits |
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Automated pattern recognition, alignment and soldering
Overlay vision alignment system with fixed beam splitter
Integrated Process Management (IPM)
Adaptive process library
Live process observation camera
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Full automatic, user independent process
Outstanding placement accuracy and instant operation without adjustments
Synchronized control of all process related parameters: force, temperature, time, flow, power, process environment, light and vision
Fast and easy process development
Immediate visual feedback reduces process development time
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Processes |
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Applications |
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Component removal
Site cleaning
Re-balling (array, single)
Paste printing (component, PCB)
Paste dipping
Paste dispensing
Fluxing
Soldering
Desoldering
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Soldering of:
- BGA, µBGA/CSP, QFN, PoP, QFP, PGA,
- Small passives down to 0201
- RF shields, RF frames
- Connectors, sockets
- Sub assemblies, daughter boards
- Flipchip (C4)
Single ball rework
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Technical Specifications |
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Placement accuracy: |
10 µm @ 3 sigma |
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Field of view (min)1: |
2.5 mm x 1.9 mm |
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Field of view (max)1: |
17.5 mm x 13 mm |
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Component size (min)1: |
0.25 mm x 0.25 mm |
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Component size (max)1: |
50 mm x 50 mm |
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Theta fine travel / resolution: |
± 4° / 1.0° |
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X-travel / resolution: |
380 mm / 0.64 µm |
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Y-travel / resolution: |
155 mm / 0.64 µm |
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Z-travel / resolution: |
8 mm / 0.8 µm |
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Top Heating2: |
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Power: |
900 W |
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Temperature ramp rate: |
1 K/s - 50 K/s |
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Flow range: |
10 Nl/min - 70 Nl/min |
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Board Heating2: |
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Power: |
1400 W |
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Heated area (max): |
330 mm x 170 mm |
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Flow range: |
48 Nl/min |
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MICRO ASSEMBLY
ADVANCED REWORK
