PCI LIMITED.

	PCB Assembly & Testing


MICRO ASSEMBLY

ADVANCED REWORK
FINEPLACER^® core
FINEPLACER^® core^plus
FINEPLACER^® jumbo rs
FINEPLACER^® pico rs
FINEPLACER^® micro rs
FINEPLACER^® micro hvr
FINEPLACER^® matrix rs
Related Equipment
Product Videos

FINEPLACER^® core
Energy-efficient, Cost-effective Rework

The FINEPLACER® core is a versatile rework system offering energy-efficient hot gas rework technology for a wide spectrum of SMD components from smallest components to large BGA.

The easy-to-handle machine integrates the complete SMD rework cycle into an compact design, without diminishing functionality. Quite on the contrary, professional features such as automatic calibration, Process Start Sensor, Process Gas Switching, 01005 Rework Package, PCB Recognition and a gesture-based operating interface are available, making the system a future-proof investment.

FINEPLACER® core comes with a high efficiency bottom heating developed for rework of small sized PCBs, e.g. for mobile devices.

With enhanced functionalites, the system is the "Swiss Army Knife" of professional SMD rework.

		Highlights*
		Components from 0.125 mm x 0.125 mm up to 90 mm x 90 mm Eco-friendly thermal management solution with high-efficiency hot gas top and bottom heating Automatic top heater calibration Automatic pick-up / touch-down with force measurement Automated processes Gesture-based operating interface Compact, integrated machine design Cost efficient soldering tools, compatible with all FINEPLACER® rework stations
FINEPLACER^® core Rework Station

	Features			Benefits
	Automated soldering processes Compact and robust design Vision alignment system with fixed beam splitter Intelligent thermal management Real time process observation camera			User independent process operation The whole rework cycle within one cost-effective system solution Reproducible placement accuracy Coordinated control of all process parameters: temperature, flow, time, process environment Immediate visual feedback reduces process development time

	Processes			Applications
	Component removal / De-soldering Site cleaning Re-balling Paste printing (component, PCB) Paste dipping Fluxing Soldering			Soldering of: - `BGA, µBGA/CSP, QFN, DFN, PoP, QFP, PGA, SON` - `Small passives down to 01005` - `RF shields, RF frames` - `Connectors, sockets` - `Sub assemblies, daughter boards` Pin in Paste (PiP) Trough Hole Reflow (THR) Reworkable underfill, conformal coating

	Technical SpecificationsApplications
	Placement accuracy:	25 µm
	Field of view (min)^¹:	12.1 mm x 7.6 mm
	Field of view (max)¹:	65 mm x 45 mm
	Component size (min)¹:	0.25 mm x 0.25 mm
	Component size (max)¹:	60 mm x 60 mm
	Board size (max):	350 mm x 310 mm
	Board thickness (max):	6 mm
	Thermocouples:	4
	Top Heating:
	Power:	900 W
	Temperature ramp rate:	1 K/s - 50 K/s
	Flow range:	10 Nl/min - 70 Nl/min
	Board Heating:
	Power:	900 W
	Heated area (max)²:	100 mm x 100 mm
	Flow range:	10 Nl/min - 70 Nl/min

	Modules & Options
	01005 Rework Package (new) PCB Recognition (new) Direct Component Printing Module Solder Removal Module Top Heating Module (new) Process Start Sensor Reballing Module MiniOven 04	10x Zoom Optics (new) Component Presentation Flux Transfer Module Board Printing Tools Process Gas Switching (new) Process Video Module Split Field Optics HOTBEAM

* depending on configuration/application
1 standard value, other values on request
2 optional module

For more information please contact :-

primegroup@vsnl.com

‹‹ Back