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FINEPLACER® micro rs
Hot Air SMD Rework Station

The FINEPLACER® micro rs is an enhanced hot air rework station for assembly and rework of all standard types of SMD components.

A high level of process modularity allows all rework process steps within one system. The system is at home in production environments, R&D, process development and prototyping.

The FINEPLACER® micro rs covers ultra small to large SMD components on small to large sized PCBs, with the goal to have highly reproducible soldering results.

     Highlights*
 
  • Industry-leading thermal management
  • Components from 0.125 mm x 0.125 mm to 90 mm x 90 mm*
  • Board sizes up to 460 mm x 310 mm*
  • High efficiency board heater
  • Closed loop force control*
  • Automated top heater calibration
  • Placement accuracy better than 10 µm
    		•

    FINEPLACER® micro rs

    		    

      Features     Benefits  
     
  • Automated soldering processes
  • Overlay vision alignment system (VAS) with fixed beam splitter
  • Modular design
  • Integrated Process Management (IPM)
  • Real time process observation camera
  • Adaptive process library
  • Process transfer from system to system
    		•    
  • Hands-off component placement, user independent process operation
  • Outstanding placement accuracy and instant operation without adjustments
  • Provides high level of application flexibility
  • Synchronized control of all process related parameters: force, temperature, time, flow, power, process environment, light and vision
  • Immediate visual feedback reduces process development time
  • Fast and easy process development
  • Identical results on different machines allow central profile development,administration and distribution

    		•  

      Processes     Applications  
     
  • Component removal
  • Site cleaning
  • Re-balling (array, single)
  • Paste printing (component, PCB)
  • Paste dipping
  • Paste dispensing
  • Fluxing
  • Soldering
  • Desoldering
    		•    
  • Soldering of:
    •    - BGA, µBGA/CSP, QFN, DFN, PoP, QFP, PGA, SON
       - Small passives down to 0201
       - RF shields, RF frames
       - Connectors, sockets
       - Sub assemblies, daughter boards
       - Flipchip (C4)
  • Pin in Paste (PiP)
  • Trough Hole Reflow (THR)
  • Reworkable underfill, conformal coating
  • Single ball rework

    		•  

      Technical Specifications  
         Placement accuracy: 10 µm  
         Field of view (min)1: 13.8 mm x 11.6 mm  
         Field of view (max)1: 71 mm x 58 mm  
         Component size (min)1: 0.125 mm x 0.125 mm  
         Component size (max)1: 60 mm x 60 mm  
         Thermocouples2*: 2-8  
         Top Heating2:  
         Power: 900 W  
         Temperature ramp rate: 1 K/s - 50 K/s  
         Flow range: 10 Nl/min - 70 Nl/min  
         Board Heating2:  
         Power: 2100 W   
         Heated area (max): 380 mm x 285 mm  
         Flow range: 96 Nl/min  
       

      Modules & Options  
     
  • Board Printing Tools
  • Process Start Sensor
  • Direct Component Printing Module (DCP)
  • Flux Transfer Module
  • Process Video Module
  • Solder Removal Module
  • Top Heating Module
  • MiniOven 04

  • Bottom Heating Module
  • Component Presentation
  • Dispenser Module
  • Process Gas Switching
  • Reballing Module
  • Split Field Optics
  • HOTBEAM
    		•   
           

    * depending on configuration/application
    1 standard value, other values on request
    2 optional module


    For more information please contact :- 
    primegroup@vsnl.com


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