PCI LIMITED.

	PCB Assembly & Testing


MICRO ASSEMBLY

ADVANCED REWORK
FINEPLACER^® core
FINEPLACER^® core^plus
FINEPLACER^® jumbo rs
FINEPLACER^® pico rs
FINEPLACER^® micro rs
FINEPLACER^® micro hvr
FINEPLACER^® matrix rs
Related Equipment
Product Videos

FINEPLACER^® jumbo rs
Large Area Rework Station

The FINEPLACER® jumbo rs is a hot air rework station dedicated to handling medium to large sized boards and SMD components with high heat absorption.

Capable of handling the smallest components with pitch down to 200 micron to large BGA components, utilizing a large field of view.

The open system architecture system allows performance of the complete rework cycle within one platform.

		Highlights*
		Components from 0.5 mm x 0.5 mm to 90 mm x 140 mm* Board sizes up to 750 mm x 500 mm* 4 zone segment board heater with flexible board holder* Automated top heater calibration Closed loop force control* Placement accuracy better than 15 µm
FINEPLACER^® jumbo rs

	Features			Benefits
	Automated processes Overlay vision alignment system with fixed beam splitter Integrated process management (IPM) Real time process observation System to system process reproducibility Adaptive process library			Hands-off component placement, user independent process operation Outstanding placement accuracy without adjustments Synchronized control of all process related parameters: force, temperature, time, flow, power, process environment and illumination Immediate visual feedback reduces process development time Direct process transfer from development to production saves time and guarantees reliable results anywhere Process library allows fast and easy process development for perfectly tailored soldering profiles

	Processes			Applications
	Component removal Site cleaning Re-balling (array, single) Paste printing (component, PCB) Paste dipping Paste dispensing Fluxing Soldering Desoldering			Soldering of: - `BGA, Super BGA, µBGA/CSP, QFN, DFN, PoP, QFP, PGA, SON` - `Small passives down to 0603` - `RF shields, RF frames` - `Connectors, sockets` - `Sub assemblies, daughter boards` - `Flipchip (C4)` Pin in Paste (PiP) Trough Hole Reflow (THR) Reworkable underfill, conformal coating

	Technical SpecificationsApplications
	Placement accuracy:	15 µm
	Field of view (min)¹:	13 mm x 9.5 mm
	Field of view (max)¹:	83 mm x 62 mm
	Component size (min)¹:	0.5 mm x 0.5 mm
	Component size (max)¹:	80 mm x 80 mm
	Thermocouples²*:	2-8
	Top Heating²:
	Power:	900 W
	Temperature ramp rate:	1 K/s - 50 K/s
	Flow range:	10 Nl/min - 70 Nl/min
	Board Heating²:
	Power:	2100 W
	Heated area (max):	280 mm x 250 mm
	Flow range:	96 Nl/min

	Modules & Options
	Board Printing Tools Process Start Sensor Direct Component Printing Module (DCP) Flux Transfer Module Process Video Module Solder Removal Module Top Heating Module MiniOven 04	Bottom Heating Module Component Presentation Dispenser Module Process Gas Switching Reballing Module Split Field Optics HOTBEAM

* depending on configuration/application
1 standard value, other values on request
2 optional module

For more information please contact :-

primegroup@vsnl.com

‹‹ Back